Friday June 19th, 2009 | |
| Time: | 2:00 PM - 3:00 PM |
| Contact: | Bonnie Fox Phone: 764-3346 Email: bonfox@umich.edu |
| Location: | 1200 EECS 1301 Beal Ave. Ann Arbor, MI 48109 (click for map) |
| Information: | |
| Multifunctional, MEMS-based neural interfaces developed in the framework of the European Project NeuroProbes Dr. Patrick Ruther Department of Microsystems Engineering (IMTEK), University of Freiburg, Germany The fundamental understanding of neuronal operations relies on electrical recordings of single neuron activity, traditionally performed using single wire electrodes or small ensembles of electrodes. This limitation in the number of recording sites can be overcome with multi-electrode probes based on fabrication technologies used for integrated circuits (IC) and microelectromechanical systems (MEMS). These electrode systems enable the arrangement of electrodes as two-dimensional (2D) and three-dimensional (3D) arrays. NeuroProbes, a multinational research project funded by the European Commission with the participation of 14 institutions in 10 European countries, addresses the development of multi-functional multi-electrode arrays for neural recording and stimulation. Technological, biological and industrial partners cooperate within NeuroProbes to realise progressively complex system architectures with continuous feedback from biological experiments, ultimately aiming for commercial exploitation. NeuroProbes is based on a unique microsystem integration solution to enable the modular integration of diverse features into a common platform forming a 3D probe array. This solution combines recording and stimulating electrodes with microfluidic functionality for drug delivery, biosensors to detect specific chemicals in the brain as well as CMOS-based electronics to realize high density electrode arrays with a pitch of 40 µm along the entire probe shaft. The functional subcomponents, i.e. micro electrode and electronics, microfluidic system and biosensor, are integrated on needle-like silicon shafts with lengths of up to 8 mm. These needles are assembled to comb-like structures which in turn are inserted in a common backbone forming 3D arrays. The electrical interconnection of the probes with external measurement equipment is performed using highly flexible ribbon cables with a thickness of 10 µm. | |